Ersa IR/PL650


The flexible rework powerhouse for challenging tasks


Flexible desoldering, placement and soldering of all types of surface mounted devices (SMD), especially: high mass BGA, metallic BGA, CGA, CCGA, BGA socket, multilayer boards or aluminium laminated substrate, BGA-multiway connector, large QFP, large PLCC, high pole THT components; for QFP components an optional split optics cassette is available.